SP-X Solder Paste Relife 158'C
Features
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This is perfect for Mobile Phones, Laptops, Gaming Consoles BGA SMT applications.
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Specially designed formula for temperature critical repairs.
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158 Degree Melting Point. Best for Iphone X/XS/XS Max Middle Layer.
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Excellent Wetting Compatibility.
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Viscosity : 178 +/-10, Volume : 50g, Alloy : Sn63/Pb37
