SP-X Solder Paste Relife 158'C

  • Rs. 499.00
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Features

  •  This is perfect for Mobile Phones, Laptops, Gaming Consoles BGA SMT applications.

  •  Specially designed formula for temperature critical repairs.

  •  158 Degree Melting Point. Best for Iphone X/XS/XS Max Middle Layer.

  •  Excellent Wetting Compatibility.

  •  Viscosity : 178 +/-10, Volume : 50g, Alloy : Sn63/Pb37


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