S-60 BGA-IC Glue Remover

  • Rs. 399.00
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Ehanced version BGA-IC adhesive solution S-60 also can help you to remove all kind of mobile phone frame sealing glue easily.

This product can be use to soften and remove the underfiller of mobile phone FC BGA chip and CPU chip.It's made of the chemicals from DuPont. The formula of it is latest environmental friendly and safest.It has good permeability ,it can quickly soften and loosens solidfied resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon . It does not do harm to circuit board and component.

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