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QC-20 BGA-IC Glue Remover

QC-20 BGA-IC Glue Remover

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Feature:

  • 20ml BGA IC glue epoxy remover QC20.

  • Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.

  • Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

  • It won't do harm to your circuit board and components. Environment friendly and safe.

  • Doesn't contain any Benzene Coderivative substances with cause leukaemia. Convenient to use

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