MECHANIC Aluminum alloy Needle Putter (P08)
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MECHANIC MCN-P08 No-clean Solder Paste Flux Soldering Tin BGA Electric Welding Flux for PCB BGA SMD
High bond strength, PH value neutral, insulation is strong, welding surface smooth. IC and PCB for no corrosive.Its boiling point only slightly higher than the melting point of the solder.For mobile phones, PC cards and other sophisticated electronic chip-level help welding.